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contact       email: info@lecc.com   phone: 1-877-570-4880   fax: 1-877-570-4700   location: [find an office]     product line     product offerings Sil-Pad; thermally conductive interface materials, Bond Ply & Liqui-bond; thermally conductive adhesives, Gap pads; thermally conductive gap filling materials, Hi-Flow; phase change interface materials, TIC; thermal interface compunds, Thermal Clad; PCB with insulated metal substrates. featured product   The Bergquist Company developed the Gap Pad thermal interface material family to meet the electronics industry's growing need for interface materials with greater conformability, higher thermal performance and easier application. Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present.     Gap Pad provides: Elimination of air gaps to reduce thermal resistance High conformability to reduce interfacial resistance Low-stress vibration dampening Compatible with automated dispensing equipment   Gap Pad VO Soft Highly Conformable, Thermally Conductive Material for Filling Air Gaps Gap Pad VO Conformable, Thermally Conductive Material for Filling Air Gaps Gap Pad VO Ultra Soft Ultra Conformable, Thermally Conductive Material for Filling Air Gaps Gap Pad 1000SF Thermally Conductive, Silicone-Free Gap Filling Material Gap Pad HC1000 “Gel-Like” Modulus Gap Filling Material Gap Pad 1500 Thermally Conductive, Unreinforced Gap Filling Material Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Gap Pad A2000 High Performance, Thermally Conductive Gap Filling Material Gap Pad 2000S40 Thermally Conductive, Reinforced “S-Class” Gap Filling Material Gap Pad 2500S20 Thermally Conductive, Reinforced “S-Class” Gap Filling Material Gap Pad 2500 Thermally Conductive, Unreinforced Gap Filling Material Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Gap Filler 1000 (Two-Part) Thermally Conductive, Liquid Gap Filling Material Gap Filler 1100 SF (Two-Part) Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Gap Filler 2000 High Performance Thermally Conductive Liquid Gap Filling Material Gap Filler 3500S35 (Two-Part) Thermally Conductive Liquid Gap Filling Material   more information www.bergquistcompany.com sales and service 805-987-4880       home - contact - line card - products - exhibition - announcement Copyright © Luscombe Engineering, 2008. All Rights Reserved | Exchange | Intranet | CRM